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Desktop Processor Physical Damage Information—Damage Due to External Causes


Last Reviewed: 07-Feb-2017
Article ID: 000007223

Processor physical damage information (damage to the product due to external causes)

  • Damage is caused by improper integration, installation or usage of the product outside of its designed specifications. Improper packaging of the returned product while shipping back to Intel may also cause this damage to occur during the transportation process.
  • Customer returned product is visually inspected for damage due to external causes upon receipt of the product at an Intel authorized location. The products are visually screened using the naked eye or a 3X magnification scope without applying any mechanical or electrical pressure on the products.
  • Physical damage information (damage to the product due to external causes) indicates that the products was tampered with and changed from its original shipment & usage condition and Violates the Intel Warranty Policy as stated below:
Note Any mark left by the motherboard sockets under normal usage is not considered damage to the product due to external causes.
 

For more warranty information visit the 3 Year Limited Warranty for Intel® Boxed Processors page.

Possible physical damage to the product due to external causes Categories

Defect Symptom Description Examples
Components Missing or Damaged The component is missing from the required location or there is evidence of crack, chips and damages to the components.
Missing component
Picture above: Missing component

Cracked component
Picture above: Cracked component
Heat Spreader Damages / Cracks / Scratches. Reject if there is any cracks, breaks, chips, smashed corners, peeling, or blistering on the heat spreader. Reject if Scratches are exposing the base metal.
scratched heat spreader 1

scratched heat spreader 2
Picture above: indicates that the heat spreader is deeply scratch
Package - Damaged/Deformed

(*Package is also known as substrate)
Package is damaged with cracks, trace cuts, expose trace, masking peel-offs caused by dropping or misusage of the product.
masking peel-offs
Picture above: masking peel-offs
Contamination or Foreign Material Presence of foreign material on Package, land pads & pins. Foreign materials could not be removed using approved cleaning solvent.
Foreign Material on CPU surface & land pads

Picture above: Foreign Material on CPU surface & land pads

Foreign Material on CPU Pins
Picture above: Foreign Material on CPU Pins
Damaged / Bent Pins Gross bent pin, compound bow or twisted pin which prevents the processor from properly being installed in the CPU socket. This includes missing pins.
CPU Pins are bent
Picture above: CPU Pins are bent

Silicon (Die) - Damaged/Deformation
Chip-off or crack on the die side.
Chip off on the edge of CPU Die
Picture above: Chip off on the edge of CPU Die
Silicon (Die) - Scratches scratch with length > ~25% of the shortest die lengthor > 3 Visible scratches.
Scratch on the on the CPU Die more than 25% of the length

Picture above: Scratch on the on the CPU Die more than 25% of the length

>3 Visible Scratches
Picture above: >3 Visible Scratches
Thermally Damaged CPU Thermal Damage (Burn Mark) on CPU Package, Components or die.
CPU is thermally damaged

Picture above : CPU is thermally damaged
 

Appendix A

Multiple processor views