This page lists the tested chassis for the Intel® Server Board S2600CP Family, in the followings sections:
|P4308CP4MHEN||S2600CP4 board in an Intel P4000 pedestal chassis, rackable |
|P4308CP4MHGC||S2600CP4 board in an Intel P4000 pedestal chassis, rackable |
|P4208CP4MHGC||S2600CP4 board in Intel P4000 pedestal chassis, rackable |
Reference chassis list
The reference chassis list includes third-party chassis tested for the Intel® Server Board S2600CP Family. Chassis are tested to see if they provide adequate airflow to meet individual manufacturer temperature specifications.
|Vendor||Model||Chassis Type||Power Supply||Unpackage Shock Test||Thermal Test Level||Driver Support|
|Chenbro*||SR112||Pedestal||Single||Pass with 25G||1||A and B|
|Chenbro||SR105||Pedestal||Single||Pass with 25G||2||A and B|
|Chenbro||RM137||Rack/1U||Single||Pass with 25G||2||A and B|
|Chenbro||RM13604H01*13114||Rack/1U||Single||N/A||3||A and B|
|Chenbro||RM417||Rack/4U||H/S||N/A||1||A and B|
|Chenbro||RM13704-500CP||Rack/1U||Single||Pass with 25G||2||A and B|
|In-win*||PV689||Pedestal||Single||Pass with 25G||1||A and B|
|In-win||PP689||Pedestal||Single||Pass with 25G||2||A and B|
|TST*||ESR316||Rack/3U||H/S||Pass with 25G||1||A and B|
|ASS*||ST104A-HB-L-I2600||Rack/1U||Single||Pass with 25G||1||A and B|
|CI-Design*||NSR224||Rack/2U||H/S||Pass with 25G||1||A and B|
|Note||Results are posted when new chassis are tested.|
U is multiple of 1.75 inches (4.445 cm)
- H/S = Hot Swap Redundant
- Singe = Single power supply
Thermal test level
Thermal testing is done on Intel® Server Boards for all listed third-party reference chassis. The server board is configured to use a generic fan control scheme that runs all attached system fans at 100 percent pulse width modulation (PWM). The generic fan control scheme is set by selecting the OTHER CHASSIS option using the FRUSDR Configuration Utility.
Results are not guaranteed if the fan control PWM rate is reduced or changed from the tested configuration. If you change the PWM rate, you are responsible for all required thermal validation to make sure that the system configurations meet the maximum thermal limits.
The table lists the chassis configuration summary and the highest level of Intel thermal testing achieved.
|Level||Board Revision||Processor||Maximum Speed||CPU TDP||Manufacturing Process Technology||Number of Drives||Ambient Temperature|
|1||All||Intel® Xeon® Processor E5-2600 Sequence||2.93 GHz||130W||32 nm||1||35 Celsius|
|2||All||Intel® Xeon® Processor E5-2600 Sequence||2.93 GHz||130W||32 nm||1||30 Celsius|
|3||All||Intel® Xeon® Processor E5-2600 Sequence||2.6 GHz||95W||32 nm||1||30 Celsius|
|Option Designator||Supported Drive Type|
The testing information is provided as a guide for the reseller in choosing chassis products that are compatible with the Intel® Server Board. The reseller is encouraged to test the chassis products in specific configurations.
IMPORTANT INFORMATION AND DISCLAIMERS: The content of the Web site links located in the tested chassis list is not controlled by Intel. These links are being offered for your convenience and should not be viewed as an endorsement by Intel of the content, products, or services offered there. This listing is not intended to be all inclusive, nor is it an endorsement by Intel; it only represents chassis Intel has examined to date. Users of this list are reminded to check with the chassis manufacturer to get latest model specifications and ensure a particular chassis model is adequate for the user's intended purposes. This list is subject to change at any time. Check this Web site regularly for updates. For purposes of future server board introductions, Intel may test current and additional chassis, which may result in a revision of this chassis list. Intel reserves the right to modify this document at any time without notice. Intel assumes no responsibility for any errors which may appear in this document, nor does it make any commitment to update the information contained in it. Intel disclaims any liability or obligation for damages of any kind arising out of the application or use of the information contained in this document.
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