The browser version you are using is not recommended for this site.Please consider upgrading to the latest version of your browser by clicking one of the following links.
We are sorry, This PDF is available in download format only
Intel Global Manufacturing FactsOperating 24 hours a day, seven days a week in plants around the world, Intel's factories are precision tuned to perform with maximum efficiency and quality to produce fast, smart, and more energy-efficient computer chips.• With nine wafer fabrication plants (fabs) in production and seven assembly test facilities worldwide, Intel's manufacturing facilities employ exceptional flexibility on a global and virtual network. By design, these facilities are consistently sharing information to improve product performance while further fine tuning the manufacturing process.• At the end of 2010, the majority of Intel’s microprocessors were manufactured on 300-mm wafers. In addition, by the second half of 2011 we expect to begin manufacturing microprocessors using our 22-nm process technology.• Our manufacturing processes advance according to Moore’s Law, delivering ever more functionality and performance, improved energy efficiency, and lower cost per transistor, with each generation.Manufacturing TutorialWafer fabrication or manufacturing of Intel’s microprocessors and chip sets is conducted in the U.S. (Arizona, New Mexico, Oregon, and Massachusetts). China, Ireland, and Israel. Following manufacturing, the majority of our components are then assembled and tested at facilities in Malaysia, China, Costa Rica, and Vietnam.FABSThe process of making computer chips is called fabrication. The factories where chips are made are called fabrication facilities or fabs. Intel fabs are among the most technically advanced manufacturing facilities in the world. When Intel first started making chips, the company used 2-inch-diameter wafers. Now the company uses primarily 12-inch or 300-millimeter (mm) wafers; larger wafers are more difficult to process, but the result is lower cost per chip.Read the full Global Manufacturing Facts Paper.
Intel® Atom™ platform presentation at IDF 2011
John Cormican, demonstrates Intel® Virtualization Technology at Embedded World 2010.
Intel 3-D transistors manufactured at 22nm ensure the pace of technology advancement for years to come.
See how three Intel® Atom™ chips manage calculations behind propulsion system in BLOODHOUND SSC.
Video shows storage possibilities powered by Intel® Architecture