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Intel Global Manufacturing Facts

Operating 24 hours a day, seven days a week in plants around the world, Intel's factories are precision tuned to perform with maximum efficiency and quality to produce fast, smart, and more energy-efficient computer chips.
• With nine wafer fabrication plants (fabs) in production and seven assembly test facilities worldwide, Intel's manufacturing facilities employ exceptional flexibility on a global and virtual network. By design, these facilities are consistently sharing information to improve product performance while further fine tuning the manufacturing process.
• At the end of 2010, the majority of Intel’s microprocessors were manufactured on 300-mm wafers. In addition, by the second half of 2011 we expect to begin manufacturing microprocessors using our 22-nm process technology.
• Our manufacturing processes advance according to Moore’s Law, delivering ever more functionality and performance, improved energy efficiency, and lower cost per transistor, with each generation.

Manufacturing Tutorial

Wafer fabrication or manufacturing of Intel’s microprocessors and chip sets is conducted in the U.S. (Arizona, New Mexico, Oregon, and Massachusetts). China, Ireland, and Israel. Following manufacturing, the majority of our components are then assembled and tested at facilities in Malaysia, China, Costa Rica, and Vietnam.

FABS

The process of making computer chips is called fabrication. The factories where chips are made are called fabrication facilities or fabs. Intel fabs are among the most technically advanced manufacturing facilities in the world. When Intel first started making chips, the company used 2-inch-diameter wafers. Now the company uses primarily 12-inch or 300-millimeter (mm) wafers; larger wafers are more difficult to process, but the result is lower cost per chip.

Read the full Global Manufacturing Facts Paper.

Intel Global Manufacturing Facts

Operating 24 hours a day, seven days a week in plants around the world, Intel's factories are precision tuned to perform with maximum efficiency and quality to produce fast, smart, and more energy-efficient computer chips.
• With nine wafer fabrication plants (fabs) in production and seven assembly test facilities worldwide, Intel's manufacturing facilities employ exceptional flexibility on a global and virtual network. By design, these facilities are consistently sharing information to improve product performance while further fine tuning the manufacturing process.
• At the end of 2010, the majority of Intel’s microprocessors were manufactured on 300-mm wafers. In addition, by the second half of 2011 we expect to begin manufacturing microprocessors using our 22-nm process technology.
• Our manufacturing processes advance according to Moore’s Law, delivering ever more functionality and performance, improved energy efficiency, and lower cost per transistor, with each generation.

Manufacturing Tutorial

Wafer fabrication or manufacturing of Intel’s microprocessors and chip sets is conducted in the U.S. (Arizona, New Mexico, Oregon, and Massachusetts). China, Ireland, and Israel. Following manufacturing, the majority of our components are then assembled and tested at facilities in Malaysia, China, Costa Rica, and Vietnam.

FABS

The process of making computer chips is called fabrication. The factories where chips are made are called fabrication facilities or fabs. Intel fabs are among the most technically advanced manufacturing facilities in the world. When Intel first started making chips, the company used 2-inch-diameter wafers. Now the company uses primarily 12-inch or 300-millimeter (mm) wafers; larger wafers are more difficult to process, but the result is lower cost per chip.

Read the full Global Manufacturing Facts Paper.

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