Solve Power and Cooling Challenges for Effective Computing

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Solve Power and Cooling Challenges for Effective Computing

White Paper: Dual-Core Intel® Xeon® Processor

Executive Summary

Relief has arrived for organizations that need to pack more computing capacity into existing high performance computing (HPC) facilities, while simultaneously reducing power and cooling costs. For some time, Intel has been focused on helping IT managers address these issues, by driving new levels of energy efficiency through silicon, processor, platform, and software innovation. The results of these efforts are clearly evident in the new Dual-Core Intel® Xeon® processor 5100 series (code-name Woodcrest) and the upcoming Dual-Core Intel® Itanium® 2 processor 9000 series (code-name Montecito), which dramatically increase performance and energy efficiency compared to previous generations.

These and other recent innovations are major steps toward increasing density, pure performance, price/performance, and energy efficiency for HPC solutions, but they are only the beginning. Intel researchers continue to push the limits of transistor density in next-generation process technologies, while simultaneously driving down power consumption. Intel is also delivering software tools, training, and support that help developers optimize their software for multi-core processors and 64-bit computing. These are essential efforts, since optimized software can substantially boost performance and system utilization, while contributing to the containment or even reduction of power consumption.

This paper discusses these and other advances that can help IT managers plan and implement a more comprehensive and effective strategy for expanding HPC capabilities, while improving density and reducing power and cooling costs.

Read the full Solve Power and Cooling Challenges for Effective Computing White Paper.