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This Mandarin language video describes integration of the Intel 2011-Land processors with the LGA2011 Series sockets in a motherboard factory to minimize handling damages to socket contacts. Various LGA processor insertion/removal tools are introduced. The new ILM Cover is also introduced.
Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.
Reviews corner glue use, material selection criteria, and demos proper application techniques.
Demos processor insertion and removal with Intel® LGA771 Series and Intel® LGA775 Series sockets.
Demos antenna and oscilloscope use for ESD detection, minimum tool requirements, and parameter setup.
Intel’s ESD prevention methods prevent costly damage to electronic devices.
Demos removing and replacing damaged ball grid array socket components for motherboard repair.