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Land Grid Array Socket and Package TechnologyIntroductionIn this document, Intel has integrated customer feedback and developed a reference process to serve as a manufacturing enabling solution.This recommendation focuses on the key learnings from Intel reference process development.• This document provides a baseline for customer manufacturing solution development. Manufacturing processes are unique and may require unique solutions to ensure an acceptable level of quality, reliability, and manufacturing yield. Due to differences in equipment and materials, process parameter modifications may be required.• The differences between Intel’s reference process and industry equipment capability must be considered for high volume manufacturing.• While this document applies to LGA socket processing in general, Intel Manufacturing Advantage Service (MAS) documents for individual products should also be consulted, for potential product-specific process information. MAS documents for products take precedence over this document.Customers are responsible for• Developing and characterizing their manufacturing processes to ensure
acceptable solder joint quality and reliability.Read the full Land Grid Array Socket and Package Technology module.
Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.
Demos processor insertion and removal with Intel® LGA771 Series and Intel® LGA775 Series sockets.
Reviews corner glue use, material selection criteria, and demos proper application techniques.
Demos removing and replacing damaged ball grid array socket components for motherboard repair.
Processor insertion guide for LGA1567 socket independent loading mechanism, minimizing contact damage.
Step-by-step instructions for aligning Intel® motherboards and the I/O opening on a computer chassis.