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Land Grid Array Socket and Package TechnologyIntroductionIn this document, Intel has integrated customer feedback and developed a reference process to serve as a manufacturing enabling solution.This recommendation focuses on the key learnings from Intel reference process development.• This document provides a baseline for customer manufacturing solution development. Manufacturing processes are unique and may require unique solutions to ensure an acceptable level of quality, reliability, and manufacturing yield. Due to differences in equipment and materials, process parameter modifications may be required.• The differences between Intel’s reference process and industry equipment capability must be considered for high volume manufacturing.• While this document applies to LGA socket processing in general, Intel Manufacturing Advantage Service (MAS) documents for individual products should also be consulted, for potential product-specific process information. MAS documents for products take precedence over this document.Customers are responsible for• Developing and characterizing their manufacturing processes to ensure
acceptable solder joint quality and reliability.Read the full Land Grid Array Socket and Package Technology module.
Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.
Intel’s ESD prevention methods prevent costly damage to electronic devices.
Demos antenna and oscilloscope use for ESD detection, minimum tool requirements, and parameter setup.
Mandarin: Processor insertion guide for LGA115X socket independent loading mechanism.
Guide to LGA115X socket independent loading mechanism installation, minimizing contact damage.
Ensure consistent quality and minimize accidents with handling recommendations and practices.