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D1C ISO 9001:2008Certifies that Intel Corporation—D1C in Hillsboro, Oregon, complies with the ISO 9001:2008 requirements of wafer fabrication, associated equipment, and processes.Read the full D1C ISO 9001:2008 Certification.
Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.
Demos processor insertion and removal with Intel® LGA771 Series and Intel® LGA775 Series sockets.
Reviews corner glue use, material selection criteria, and demos proper application techniques.
Demos removing and replacing damaged ball grid array socket components for motherboard repair.
Processor insertion guide for LGA1567 socket independent loading mechanism, minimizing contact damage.
Step-by-step instructions for aligning Intel® motherboards and the I/O opening on a computer chassis.