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This five-minute video reviews corner glue material selection criteria and demonstrates proper application techniques. Corner glue is added to a component to help reduce the high levels of strain that are placed on the solder joints when the component experiences a drop or shock event. Proper corner glue selection and application will help maximize reliability margins.
Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Processor insertion guide for LGA2011 socket independent loading mechanism, minimizing contact damage.
Mandarin: Processor insertion guide for LGA2011 socket independent loading mechanism.
Step-by-step instructions for aligning Intel® motherboards and the I/O opening on a computer chassis.
Shows how to attach Kyowa strain gage to Intel® Ball Grid Array packages; measures board flexure.