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Shipping, Transport Media, and Moisture Sensitivity Level: GuideAll semiconductor products must be shipped in some type of handling media. The type used is specific to the type of package, die, or wafer that is to be shipped. This document outlines the different types of shipping and handling media that Intel uses and describes how they can be recycled.Intel certifies, manufactures, classifies, labels, and ships moisture-sensitive materials according to industry standards. This document includes a thorough discussion of the packing process and handling considerations unique to moisture-sensitive products, such as the use of moisture barrier bags, desiccants, and humidity indicator cards.Read the full Shipping, Transport Media, and Moisture Sensitivity Level: Guide.
Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.
Demos processor insertion and removal with Intel® LGA771 Series and Intel® LGA775 Series sockets.
Reviews corner glue use, material selection criteria, and demos proper application techniques.
Demos removing and replacing damaged ball grid array socket components for motherboard repair.
Processor insertion guide for LGA1567 socket independent loading mechanism, minimizing contact damage.
Step-by-step instructions for aligning Intel® motherboards and the I/O opening on a computer chassis.