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Strain Measurement Methodology for Circuit Board Assembly: GuideMost manufacturers now use strain gauges to monitor board flexure. There are many different strain measurement methods in use. The results from different methods usually cannot be compared. Intel has published its strain method, and is determining strain guidance for many of its ball grid array (BGA) components and sockets. This will help manufacturers know what strain levels show a risk for BGA components and sockets.This document will enable manufacturers to compare strain results to the Intel strain guidance by creating a strain report. Several steps are required to make a reliable strain report and are explained in detail: • Prepare test boards by mounting strain gauges in specified locations• Identify all assembly steps that may cause flexure• Measure the strain during these assembly steps• Identify the maximum strain values• Make a report showing the maximum strain values and the strain guidanceRead the full Strain Measurement Methodology for Circuit Board Assembly: Guide.
Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.
Reviews corner glue use, material selection criteria, and demos proper application techniques.
Demos processor insertion and removal with Intel® LGA771 Series and Intel® LGA775 Series sockets.
Demos antenna and oscilloscope use for ESD detection, minimum tool requirements, and parameter setup.
Intel’s ESD prevention methods prevent costly damage to electronic devices.
Demos removing and replacing damaged ball grid array socket components for motherboard repair.