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Surface Mount Board Assembly Soldering: GuideThis document addresses the surface mount technology (SMT) board assembly process for reflow soldering SMT components to boards, as well as rework soldering for removing and replacing individual components on already-assembled boards.The information in this document is for only reference. Manufacturing processes are unique, and might require unique solutions to ensure acceptable levels of quality, reliability, and manufacturing yield. Due to differences in equipment and materials, customer-specific process parameter development and validation is required.Graphics and schematics provide a visual interpretation of the information covered in the four sections below: • Solder Paste Printing• Component Placement• Reflow Soldering• ReworkRead the full Surface Mount Board Assembly Soldering: Guide.
Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.
Reviews corner glue use, material selection criteria, and demos proper application techniques.
Demos processor insertion and removal with Intel® LGA771 Series and Intel® LGA775 Series sockets.
Demos antenna and oscilloscope use for ESD detection, minimum tool requirements, and parameter setup.
Intel’s ESD prevention methods prevent costly damage to electronic devices.
Demos removing and replacing damaged ball grid array socket components for motherboard repair.