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Surface Mount Board Assembly Soldering: GuideThis document addresses the surface mount technology (SMT) board assembly process for reflow soldering SMT components to boards, as well as rework soldering for removing and replacing individual components on already-assembled boards.The information in this document is for only reference. Manufacturing processes are unique, and might require unique solutions to ensure acceptable levels of quality, reliability, and manufacturing yield. Due to differences in equipment and materials, customer-specific process parameter development and validation is required.Graphics and schematics provide a visual interpretation of the information covered in the four sections below: • Solder Paste Printing• Component Placement• Reflow Soldering• ReworkRead the full Surface Mount Board Assembly Soldering: Guide.
Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.
Demos processor insertion and removal with Intel® LGA771 Series and Intel® LGA775 Series sockets.
Reviews corner glue use, material selection criteria, and demos proper application techniques.
Demos removing and replacing damaged ball grid array socket components for motherboard repair.
Processor insertion guide for LGA1567 socket independent loading mechanism, minimizing contact damage.
Step-by-step instructions for aligning Intel® motherboards and the I/O opening on a computer chassis.