Surface Mount Board Assembly Soldering: Guide
This document addresses the surface mount technology (SMT) board assembly process for reflow soldering SMT components to boards, as well as rework soldering for removing and replacing individual components on already-assembled boards.
The information in this document is for only reference. Manufacturing processes are unique, and might require unique solutions to ensure acceptable levels of quality, reliability, and manufacturing yield. Due to differences in equipment and materials, customer-specific process parameter development and validation is required.
Graphics and schematics provide a visual interpretation of the information covered in the four sections below:
• Solder Paste Printing
• Component Placement
• Reflow Soldering
Read the full Surface Mount Board Assembly Soldering: Guide.