The browser version you are using is not recommended for this site.Please consider upgrading to the latest version of your browser by clicking one of the following links.
We are sorry, This PDF is available in download format only
Component Surface Mount Technology: GuideTraditional through-hole dual in-line package assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at about 68L. Surface mount technology (SMT) allows production of more reliable assemblies with higher I/O, increased board density, and reduced weight, volume, and cost. The weight of printed board assemblies using SMT is reduced because surface mount components (SMC) can weigh up to 10 times less than their conventional counterparts and occupy about one-half to one-third the space on the printed board surface.SMT also provides improved shock and vibration resistance due to the lower mass of components. The smaller lead lengths of surface mount components reduce parasitic losses and provide more effective decoupling. The smaller size of SMCs and the option of mounting them on either or both sides of the printed board reduces board real estate, and savings are realized through a reduction in material and labor costs associated with automated assembly.Read the full Component Surface Mount Technology: Guide.
Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.
Demos processor insertion and removal with Intel® LGA771 Series and Intel® LGA775 Series sockets.
Reviews corner glue use, material selection criteria, and demos proper application techniques.
Demos removing and replacing damaged ball grid array socket components for motherboard repair.
Processor insertion guide for LGA1567 socket independent loading mechanism, minimizing contact damage.
Step-by-step instructions for aligning Intel® motherboards and the I/O opening on a computer chassis.