The browser version you are using is not recommended for this site.Please consider upgrading to the latest version of your browser by clicking one of the following links.
We are sorry, This PDF is available in download format only
Component Surface Mount Technology: GuideTraditional through-hole dual in-line package assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at about 68L. Surface mount technology (SMT) allows production of more reliable assemblies with higher I/O, increased board density, and reduced weight, volume, and cost. The weight of printed board assemblies using SMT is reduced because surface mount components (SMC) can weigh up to 10 times less than their conventional counterparts and occupy about one-half to one-third the space on the printed board surface.SMT also provides improved shock and vibration resistance due to the lower mass of components. The smaller lead lengths of surface mount components reduce parasitic losses and provide more effective decoupling. The smaller size of SMCs and the option of mounting them on either or both sides of the printed board reduces board real estate, and savings are realized through a reduction in material and labor costs associated with automated assembly.Read the full Component Surface Mount Technology: Guide.
Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.
Intel’s ESD prevention methods prevent costly damage to electronic devices.
Demos antenna and oscilloscope use for ESD detection, minimum tool requirements, and parameter setup.
Mandarin: Processor insertion guide for LGA115X socket independent loading mechanism.
Guide to LGA115X socket independent loading mechanism installation, minimizing contact damage.
Ensure consistent quality and minimize accidents with handling recommendations and practices.