The browser version you are using is not recommended for this site.Please consider upgrading to the latest version of your browser by clicking one of the following links.
We are sorry, This PDF is available in download format only
Intel® Xeon® Processor E5-2400 Product Family: Thermal Guide
This document provides guidelines for the design of thermal and mechanical solutions for server and workstation processors in the Intel® Xeon® processor E5-2400 product family platform. The processors covered include those listed in the Intel® Xeon® processor E5-2400 product family datasheet - volume one. The components described in this document include:• The processor thermal solution (heatsink) and associated retention hardware.• The LGA1356 socket, the independent loading mechanism (ILM) and back plate.The goals of this document are:• To assist board and system thermal mechanical designers.• To assist designers and suppliers of processor heatsinks.Thermal profiles and other processor specifications are provided in the appropriate datasheet.Read the full Intel® Xeon® Processor E5-2400 Product Family TMDG: http://www.intel.com/content/www/us/en/processors/xeon/xeon-e5-2400-thermal-guide.html
Intel® Integrated I/O merges the I/O controller onto the processor for reduced latency.
For data center servers or cloud, new Intel® Xeon® processors combine flexibility with efficiency.
Intel® Xeon® processors and Intel® SSDs boost performance, enhancing AutoCAD* 2013’s new workflow.
Five-minute video addressing key innovations of the Cisco UCS M3* line based on Intel® Xeon® processor E5 family.
Movie to promote Intel® Xeon® E5-2600 v2 systems
Animation: Increase server performance with more cores, greater memory, and Intel® Turbo Boost Technology 2.0.