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Intel® Xeon® Processor 7500 Series / Westmere-EX Processor Thermal and Mechanical Design Guide

Intel® Xeon® Processor 7500 Series: Thermal/Mechanical Guide

Introduction

This document provides guidelines for the design of thermal and mechanical solutions for the Intel® Xeon® processor 7500 series and the Intel® Xeon® processor E7-8800/4800/2800 product families. Both processors are compatible with the LGA1567 Socket (Chapter 2) and the ILM (Chapter 3). Both processors adhere to the same thermal specifications found in the Intel® Xeon® Processor E7-8800/4800/2800 Product Families Datasheet, Volume 1 and Intel® Xeon® Processor 7500 Series Datasheet, Volume 1 (see Table 1-1, “Reference Documents”). Thermal solutions designed for the Intel Xeon processor 7500 series will also be compatible with Intel Xeon processor E7-8800/4800/2800 product families (Chapter 4). The components described in this document include:
• The processor thermal solution (heatsink) and associated retention hardware• The LGA1567 socket, Independent Loading Mechanism (ILM) and back plate

The goals of this document are:

• To assist board and system thermal mechanical designers
• To assist designers and suppliers of processor heatsinks

Thermal profiles and other processor specifications are provided in Intel® Xeon® Processor E7-8800/4800/2800 Product Families Datasheet, Volume 1 and Intel® Xeon® Processor 7500 Series Datasheet, Volume 1.

Read the full Intel® Xeon® Processor 7500 Series Thermal Guide.

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