The browser version you are using is not recommended for this site.Please consider upgrading to the latest version of your browser by clicking one of the following links.
We are sorry, This PDF is available in download format only
Intel® Xeon® Processor 7500 Series: Thermal/Mechanical GuideIntroductionThis document provides guidelines for the design of thermal and mechanical solutions for the Intel® Xeon® processor 7500 series and the Intel® Xeon® processor E7-8800/4800/2800 product families. Both processors are compatible with the LGA1567 Socket (Chapter 2) and the ILM (Chapter 3). Both processors adhere to the same thermal specifications found in the Intel® Xeon® Processor E7-8800/4800/2800 Product Families Datasheet, Volume 1 and Intel® Xeon® Processor 7500 Series Datasheet, Volume 1 (see Table 1-1, “Reference Documents”). Thermal solutions designed for the Intel Xeon processor 7500 series will also be compatible with Intel Xeon processor E7-8800/4800/2800 product families (Chapter 4). The components described in this document include:• The processor thermal solution (heatsink) and associated retention hardware• The LGA1567 socket, Independent Loading Mechanism (ILM) and back plateThe goals of this document are:• To assist board and system thermal mechanical designers• To assist designers and suppliers of processor heatsinksThermal profiles and other processor specifications are provided in Intel® Xeon® Processor E7-8800/4800/2800 Product Families Datasheet, Volume 1 and Intel® Xeon® Processor 7500 Series Datasheet, Volume 1.Read the full Intel® Xeon® Processor 7500 Series Thermal Guide.
The Intel® Xeon® processor E7 v2 family supports real-time analytics with better performance.
Real-time predictive analytics and business intelligence uncovers new performance, opportunities.
Intel® Xeon® processor E7 v2 family-based platforms help Virtustream offer reliability, performance.
Demos the Intel® Xeon® processor E7 v2 family processing and predictive analytics performance.
Intel® Integrated I/O merges the I/O controller onto the processor for reduced latency.
Intel® Xeon® processors and Intel® SSDs boost performance, enhancing AutoCAD* 2013’s new workflow.