The browser version you are using is not recommended for this site.Please consider upgrading to the latest version of your browser by clicking one of the following links.
We are sorry, This PDF is available in download format only
Dual-Core Intel® Xeon® Processor 7000 Sequence: Thermal/Mechanical GuideObjectiveThe purpose of this guide is to describe the reference thermal solution and design parameters required for the dual-core Intel® Xeon® processor 7000 sequence. It is also the intent of this document to comprehend and demonstrate the processor cooling solution features and requirements. Furthermore, this document provides an understanding of the processor thermal characteristics, and discusses guidelines for meeting the thermal requirements imposed on the entire life of the processor. The thermal/mechanical solutions described in this document are intended to aid component and system designers in the development and evaluation of processor compatible solutions.ScopeThe thermal/mechanical solutions described in this document pertain only to a solution(s) intended for use with the Dual-Core Intel Xeon processor 7000 sequence in 2U+ form factor systems. This document contains the mechanical and thermal requirements of the processor cooling solution. In case of conflict, the data in the dual-core Intel® Xeon® Processor 7000 Sequence Datasheet supersedes any data in this document. Additional information is provided as a reference in the appendix section(s).Read the full Dual-Core Intel® Xeon® Processor 7000 Sequence Thermal Guide.
Using Intel® Node Manager on Intel® Xeon® processor 5500 series platforms.
Intel® Integrated I/O merges the I/O controller onto the processor for reduced latency.
Intel® Xeon® processors and Intel® SSDs boost performance, enhancing AutoCAD* 2013’s new workflow.
The Intel® Xeon® processor E7 v2 family supports real-time analytics with better performance.
Real-time predictive analytics and business intelligence uncovers new performance, opportunities.
The Intel® Xeon® processor E5 family merges the I/O hub onto the processor for improved efficiency.