The browser version you are using is not recommended for this site.Please consider upgrading to the latest version of your browser by clicking one of the following links.
We are sorry, This PDF is available in download format only
Intel® Xeon® Processor 5500/5600 Series: Thermal/Mechanical GuideIntroductionThis document provides guidelines for the design of thermal and mechanical solutions for 2-socket server and 2-socket Workstation processors listed in the Intel® Xeon® Processor 5500 Series Datasheet, Volume 1 and in the Intel® Xeon® Processor 5600 Series Datasheet, Volume 1. The components described in this document include:• The processor thermal solution (heatsink) and associated retention hardware.• The LGA1366 socket and the Independent Loading Mechanism (ILM) and back plate. Processors in 1-socket Workstation platforms are covered in the Intel® Core™ i7-900 Desktop Processor Extreme Edition Series and Intel® Core™ i7-900 Desktop Processor Series, Intel® Xeon® Processor 3500 Series and LGA1366 Socket Thermal / Mechanical Design Guide.The goals of this document are:• To assist board and system thermal mechanical designers.• To assist designers and suppliers of processor heatsinks. Thermal profiles and other processor specifications are provided in the Datasheet.Read the full Intel® Xeon® Processor 5500/5600 Series Thermal Guide.
Citrix partners with Intel for cloud interoperability and cloud on-boarding proof of concept.
Parallels works with Intel to provide security monitoring and service catalogs to deploy virtual machines.
Red Hat partners with Intel to enable business agility with Red Hat CloudForms.
Pauline Nist (Intel) and Jim Totton (Red Hat) discuss their collaborative value to enterprise computing.
Leading server innovation with the Intel® Xeon® processor E7 family for higher speed and capacity.
Video: Intel IT Tune Up contest winner discusses their upgrade to an Intel® Xeon® processor-based server.