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Intel® Xeon® Processor 5500/5600 Series: Thermal/Mechanical Guide


This document provides guidelines for the design of thermal and mechanical solutions for 2-socket server and 2-socket Workstation processors listed in the Intel® Xeon® Processor 5500 Series Datasheet, Volume 1 and in the Intel® Xeon® Processor 5600 Series Datasheet, Volume 1. The components described in document include:
• The processor thermal solution (heatsink) and associated retention hardware.
• The LGA1366 socket and the Independent Loading Mechanism (ILM) and back plate. Processors in 1-socket Workstation platforms are covered in the Intel® Core™ i7-900 Desktop Processor Extreme Edition Series and Intel® Core™ i7-900 Desktop Processor Series, Intel® Xeon® Processor 3500 Series and LGA1366 Socket Thermal / Mechanical Design Guide.

The goals of this document are:
• To assist board and system thermal mechanical designers.
• To assist designers and suppliers of processor heatsinks. Thermal profiles and other processor specifications are provided in the Datasheet.

Read the full Intel® Xeon® Processor 5500/5600 Series Thermal Guide.

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