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Intel® Xeon® Processor 3500 Series Thermal/Mechanical Design GuideThis document provides guidelines for the design of thermal and mechanical solutions for the:• Intel® Xeon® Processor 3500 Series.Unless specifically required for clarity, this document will use “processor” in place of the specific product names. The components described in this document include:• The processor thermal solution (heatsink) and associated retention hardware.• The LGA1366 socket and the Independent Loading Mechanism (ILM) and back plate.The goals of this document are:• To assist board and system thermal mechanical designers.• To assist designers and suppliers of processor heatsinks. Thermal profiles and other processor specifications are provided in the appropriate processor datasheet.Read the full Intel® Xeon® Processor 3500 Series Thermal/Mechanical Design Guide.
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