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Conroe and Allendale Electrical, Mechanical, and Thermal Specifications (EMTS)

Intel® Xeon® Processor 3000 Series: Datasheet

Datasheet on 65 nm Process in the 775-land LGA Package

The Dual-Core Intel® Xeon® processor 3000 series combines the performance of previous generation products with the power efficiencies of a low-power microarchitecture to enable smaller, quieter systems. These processors are 64-bit processors that maintain compatibility with IA-32 software.

The Dual-Core Intel® Xeon® processor 3000 series uses Flip-Chip Land Grid Array (FC-LGA6) package technology, and plugs into a 775-land surface mount, Land Grid Array (LGA) socket, referred to as the LGA775 socket.

Note: In this document unless otherwise specified, the Dual-Core Intel Xeon processor 3000 series refers to Dual-Core Intel Xeon processors 3085, 3075, 3070, 3065, 3060, 3050, and 3040. Unless otherwise specified the Dual-Core Intel Xeon processor 3000 series is referred to as “processor.”

The processors support several Advanced Technologies including the Execute Disable Bit, Intel® 64, and Enhanced Intel SpeedStep® Technology. In addition, the Dual-Core Intel® Xeon® processor 3000 series supports Intel® Virtualization Technology (Intel® VT) and Intel® Trusted Execution Technology (Intel® TXT).

The processor's front side bus (FSB) uses a split-transaction, deferred reply protocol like the Intel® Pentium® 4 processor. The FSB uses Source-Synchronous Transfer (SST) of address and data to improve performance by transferring data four times per bus clock (4X data transfer rate, as in AGP 4X). Along with the 4X data bus, the address bus can deliver addresses two times per bus clock and is referred to as a "doubleclocked" or 2X address bus. Working together, the 4X data bus and 2X address bus provide a data bus bandwidth of up to 8.5 10.7 GB/s.

Read the full Intel® Xeon® Processor 3000 Series Datasheet.

Intel® Xeon® Processor 3000 Series: Datasheet

Datasheet on 65 nm Process in the 775-land LGA Package

The Dual-Core Intel® Xeon® processor 3000 series combines the performance of previous generation products with the power efficiencies of a low-power microarchitecture to enable smaller, quieter systems. These processors are 64-bit processors that maintain compatibility with IA-32 software.

The Dual-Core Intel® Xeon® processor 3000 series uses Flip-Chip Land Grid Array (FC-LGA6) package technology, and plugs into a 775-land surface mount, Land Grid Array (LGA) socket, referred to as the LGA775 socket.

Note: In this document unless otherwise specified, the Dual-Core Intel Xeon processor 3000 series refers to Dual-Core Intel Xeon processors 3085, 3075, 3070, 3065, 3060, 3050, and 3040. Unless otherwise specified the Dual-Core Intel Xeon processor 3000 series is referred to as “processor.”

The processors support several Advanced Technologies including the Execute Disable Bit, Intel® 64, and Enhanced Intel SpeedStep® Technology. In addition, the Dual-Core Intel® Xeon® processor 3000 series supports Intel® Virtualization Technology (Intel® VT) and Intel® Trusted Execution Technology (Intel® TXT).

The processor's front side bus (FSB) uses a split-transaction, deferred reply protocol like the Intel® Pentium® 4 processor. The FSB uses Source-Synchronous Transfer (SST) of address and data to improve performance by transferring data four times per bus clock (4X data transfer rate, as in AGP 4X). Along with the 4X data bus, the address bus can deliver addresses two times per bus clock and is referred to as a "doubleclocked" or 2X address bus. Working together, the 4X data bus and 2X address bus provide a data bus bandwidth of up to 8.5 10.7 GB/s.

Read the full Intel® Xeon® Processor 3000 Series Datasheet.

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