Intel® X58 Express Chipset: Thermal and Mechanical Guide
The goals of this document are to:
• Outline the thermal and mechanical operating limits and specifications for the Intel® X58 Express Chipset IOH.
• Describe reference thermal solutions that meet the specifications of the Intel® X58 Express Chipset IOH.
Properly designed thermal solutions provide adequate cooling to maintain the Intel® X58 Express Chipset IOH case temperatures at or below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the case to local-ambient thermal resistance. By maintaining the IOH case temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the IOH. Operation outside the functional limits can cause data corruption or permanent damage to the component.
The simplest and most cost-effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise.
This document addresses thermal design and specifications for the Intel® X58 Express Chipset IOH component only. For thermal design information on other chipset components, refer to the respective component TMDG. For the ICH10, refer to the Intel® I/O Controller Hub 10 (ICH10) Thermal and Mechanical Design Guidelines.
Note: Unless otherwise specified, the term “IOH” refers to the Intel® X58 Express Chipset IOH.
Read the full Intel® X58 Express Chipset Thermal and Mechanical Guide.