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Tape Carrier Package: Databook, Chapter 12

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Intel's Packaging Databook Chapter 12: Tape Carrier Package

As semiconductor devices become more complex, they are being introduced into products that cover the spectrum of the marketplace. Portability of computing and information management is driving the reduction in size from desktop to laptop to notebook to palm top sized products. These products require lightweight small footprint integrated packaging. The Tape Carrier Package (TCP) format is one way to meet the small outline and high lead count interconnection needs of high performance microprocessors. The TCP has been designed to offer reduced pitch, thin package profiles, smaller footprint on the printed circuit board, without compromising performance. Intel continues to provide packaging solutions which meet rigorous criteria for quality and performance.

The Tape Carrier Package is no exception. Key package features include surface mount technology design, lead pitch of 0.25 mm, 48 mm tape format, polyimide-up for pick and place, and slide carrier handling. Shipped flat in slide carriers, the leads are designed to be formed into a “gull-wing” configuration and reflowed onto the PCB by one of several methods. Intel has done extensive optimization of the hot bar reflow process and suggestions for that process are included in this chapter.

Satisfactory placement and rework capability has been demonstrated by industry sources using the hot gas reflow process. Industry data also exists which demonstrates process feasibility for laser reflow. The TCP family has been characterized for thermal, electrical, and mechanical performance. Component and system level thermal testing has shown the TCP package to be capable of meeting system level thermal design needs. Additional potential board level enhancements have been identified and characterized to provide the most flexible design choices.

A full suite of component and board level stress testing has been completed to ensure that the component meets Intel’s reliability targets. Evaluations of solder joints by stress testing, lead stiffness studies, and finite element modeling have demonstrated that the mounted component will meet field use conditions and lifetimes. The TCP package is capable of meeting a wide variety of design and use applications. Table 12-1 provides an overview of TCP package attributes.

Read the full Intel Packaging Databook.