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Shock Strain Monitoring Approach: Customer Reference Document

Document: Outlines shock strain monitoring approach to evaluate second-level interconnect risks for relative design performance. (v.1.1, Mar. 2014)

Intel® Atom™ Processor E6xx Series: External Design Spec

Describes Intel® Atom™ processor E6xx series functionality, including signals, registers, and electrical descriptions. (v.4, Mar. 2013)

Maho Bay and Carlow-WS: Platform Design Guide

Platform Design Guide: Recommendations for the Maho Bay and Carlow-WS platform, including platform controller hub, system memory. (v.2.2, May 2013)

Manufacturing with Intel® FCBGA10/FCBGA11 Package Technologies

Presentation: Attributes, drawings, and guidelines for manufacturing with Intel® FCBGA10 and FCBGA11 package technologies. (v.2.5, Jul. 2014)

Shell Bay Customer Reference Board: Schematic

Schematic: Provides detailed diagrams of the Shell Bay customer reference board featuring the Intel® Platform Controller Hub EG20T. (v.3.1, Aug. 2011)

Stargo Customer Reference Board: Schematic

Schematic: Drawings, revision list, and BOM for the Stargo customer reference board development kit. (v.2.1, Jul. 2013)

Crystal Forest Gladden Schematic Design: Files

Files: Schematic design files for Crystal Forest Gladden (Stargo) includes adw, library, and ptf files. (v.2.1, Jul. 2013)

Intel® Core™2 Processor QX9000/Q9000/Q8000 Series: Spec Update

Update: Intel® Core™2 Processor QX9000/Q9000/Q8000 Series (v.1.25, Dec. 2012)

Best Mobile Devices for Small Business

Find the Best Mobile Devices for Small Business. Your business moves fast. What are you waiting for?

Mobile 3rd Generation Intel® Core™ Processor Family: Addendum

Spec Addendum: Mobile 3rd generation Intel® Core™ processor family data for signal memory, electrical, thermal, and power. (v.2.4, Feb. 2013)