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SMT Board Assembly Process Guide

Guide: Overview of surface mount technology (SMT) board assembly process including reflow soldering SMT components and component replacement.

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Electrostatic Discharge and Electrical Overstress Guide

Guide: Overview of electrostatic discharge (ESD) and electrical overstress (EOS) with preventative measures and strategies for eliminating damage.

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Intel Strain Measurement Methodology for Circuit Board Assembly

Guide: Document provides overview of board flexure control methodology, Intel(r) BFI metrics, with motherboard assembly line strain measurement.

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Intel® Manufacturing Enabling Resource Guide

Guide: Gain access to Intel® Manufacturing Advantage Services (MAS) collaterals, register new accounts, find resources, and local Intel contacts.

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Electrostatic Discharge Prevention Methods

Intel’s ESD prevention methods prevent costly damage to electronic devices; overview provides device models, theory, and case studies.

Factory Overview and Certification

Intel’s manufacturing organization, encompassing water fab, assembly, testing, boards, and outsourcing; locations, processes, certification.

Intel® Tablet Design Center

Use your Intel® Business Advantage Portal login to connect to the Data Center Design Community.

Shipping, Transport Media, and Moisture Sensitivity Level: Guide

The document outlines proper shipping and handling of semiconductors using packaging that accounts for moisture sensitivity and transportation stress.

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Land Grid Array Socket and Package Technology

Process for the handling, inspection, and integration of land grid array socket and package technology.

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Component Surface Mount Technology: Guide

Surface mount technology guide provides instructions and diagrams for more reliable assemblies, increasing density for less weight, volume, and cost.

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