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Intel® Tablet Design Center

Use your Intel® Business Advantage Portal login to connect to the Data Center Design Community.

Surface Mount Board Assembly Soldering: Guide

Guide: Explains the surface mount technology board assembly process for soldering components to boards and replacing existing components.

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Shipping, Transport Media, and Moisture Sensitivity Level: Guide

The document outlines proper shipping and handling of semiconductors using packaging that accounts for moisture sensitivity and transportation stress.

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Land Grid Array Socket and Package Technology

Process for the handling, inspection, and integration of land grid array socket and package technology.

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Strain Measurement Methodology for Circuit Board Assembly: Guide

Guide: Explains how manufacturers can compare strain measurement results to the Intel strain guidance by creating a strain report.

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Additional Resources—Intel® Learning Network: Guide

This guide provides directions on how to access information on the Intel® Learning Network, such as Manufacturing Advantage Service documents.

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Electrostatic Discharge and Electrical Overstress: Guide

Document describes how electrostatic discharge and electrical overstress are caused, the damage they cause, and methods of prevention.

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Component Surface Mount Technology: Guide

Surface mount technology guide provides instructions and diagrams for more reliable assemblies, increasing density for less weight, volume, and cost.

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Electrostatic Discharge Prevention Methods

Intel’s ESD prevention methods prevent costly damage to electronic devices; overview provides device models, theory, and case studies.

Intel® LGA115X Socket: Board Factory Mandarin

Shows proper installation of the LGA115X socket independent loading mechanism to minimize socket contact handling damage; Mandarin translation.