Use your Intel® Business Advantage Portal login to connect to the Data Center Design Community.
The document describes best methods for shipping and handling semiconductor products, with packaging suggestions that are product-specific and account for moisture sensitivity and transportation stress.
This guide provides directions on how to access information on the Intel® Learning Network (ILN), such as Manufacturing Advantage Service documents, after a user logs in or registers to use the site.
Guide: Explains how manufacturers can compare strain measurement results to the Intel strain guidance by creating a strain report that includes preparation of test boards and identifying assembly steps that could cause flexure.
Document describes how electrostatic discharge and electrical overstress are caused, how they affect integrated circuit components, and how to prevent damage through monitoring the workplace environment and proper component testing.