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Intel® Manufacturing Enabling Guide

Describes purpose of the Intel® Manufacturing Enabling Guide and provides links to chapters.

Intel Executive Perspectives on Quality and Reliability

Chief Executive Officer Paul Otellini and Director of the Corporate Quality Network Nasser Bozorg-Grayeli talk about their view of quality.

Surface Mount Board Assembly Soldering: Guide

Guide: Explains the surface mount technology board assembly process for soldering components to boards and replacing existing components.

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Electrostatic Discharge Prevention Methods

Intel’s ESD prevention methods prevent costly damage to electronic devices; overview provides device models, theory, and case studies.

Factory Overview and Certification

Intel’s manufacturing organization, encompassing water fab, assembly, testing, boards, and outsourcing; locations, processes, certification.

Global Manufacturing at Intel

Explore Intel's global manufacturing process and see where computer chips are made at wafer fabs and assembly/testing sites around the world.

Intel ISO 9001:2008 Registrations

Intel’s ISO 9001:2008 registered certifications for quality management systems.

Land Grid Array Socket and Package Technology

Process for the handling, inspection, and integration of land grid array socket and package technology.

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Electrostatic Discharge and Electrical Overstress: Guide

Document describes how electrostatic discharge and electrical overstress are caused, the damage they cause, and methods of prevention.

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Strain Measurement Methodology for Circuit Board Assembly: Guide

Guide: Explains how manufacturers can compare strain measurement results to the Intel strain guidance by creating a strain report.

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