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Factory Overview and Certification

Intel’s manufacturing organization, encompassing water fab, assembly, testing, boards, and outsourcing; locations, processes, certification.

FIPS Compliant Infrastructure with Intel Wireless: Solution Brief

Solution brief discusses Intel® Wireless products compliance with the Federal Information Processing Standard (FIPS).

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Global Manufacturing at Intel

Explore Intel's global manufacturing process and see where computer chips are made at wafer fabs and assembly/testing sites around the world.

Declaration of conformity: Homepage

Declaration of conformity: Homepage

Intel ISO 9001:2008 Registrations

Intel’s ISO 9001:2008 registered certifications for quality management systems.

Surface Mount Board Assembly Soldering: Guide

Guide: Explains the surface mount technology board assembly process for soldering components to boards and replacing existing components.

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Land Grid Array Socket and Package Technology

Process for the handling, inspection, and integration of land grid array socket and package technology.

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Strain Measurement Methodology for Circuit Board Assembly: Guide

Guide: Explains how manufacturers can compare strain measurement results to the Intel strain guidance by creating a strain report.

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Shipping, Transport Media, and Moisture Sensitivity Level: Guide

The document outlines proper shipping and handling of semiconductors using packaging that accounts for moisture sensitivity and transportation stress.

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Additional Resources—Intel® Learning Network: Guide

This guide provides directions on how to access information on the Intel® Learning Network, such as Manufacturing Advantage Service documents.

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