Intel introduces the world's first commercial conflict-free microprocessor and reconnects the dots across the globe for a responsible supply chain.
Intel introduces the world's first commercially available conflict-free microprocessor and reconnects the dots across the globe to create a responsible and humane mineral supply chain.Full View >
Former fellows and members of the GEM Consortium talk about their experiences and explain why diversity is so critical to the success of Intel.
Former fellows, mentors, and members of The National Gem Consortium (GEM) talk about their experiences with the program and the difference working with partners like Intel means to the positive development of diversity in the STEM pipeline.Full View >
Intel connects women and minorities to opportunities in the tech industry at a red carpet hiring event, helping build career relationships.
Intel connects women and under-represented minorities to opportunities in the tech industry at a red carpet hiring event, helping match up candidates with mentors, open positions at Intel, and other career relationships.Full View >
Intel Education Service Corps helps improve education worldwide: Intel staff volunteered to train teachers, students, staff at South African schools.
In the Intel Keynote for CES 2015, Brian Krzanich showcases a drone obstacle course and ping-pong with Firefly* drones and Intel® RealSense™ tech.
Watch as Brian Krzanich plays a game of "drone ping-pong" in the Intel keynote speech at CES 2015, showcasing a "drone obstacle course" featuring AscTec's Firefly* self-navigating drones and Intel® RealSense™ technology.Full View >
Intel’s ESD prevention methods prevent costly damage to electronic devices; overview provides device models, theory, and case studies.
Shows proper installation of the LGA115X socket independent loading mechanism to minimize socket contact handling damage; Mandarin translation.
Shows processor insertion into the LGA2011 socket independent loading mechanism to minimize socket contact handling damage; Mandarin translation.
Instructions for properly aligning the Intel® motherboard and the I/O opening on a computer chassis to ensure proper fitting of the shield plate.
Package-on-package device rework demos developing a thermal reflow profile, PCB pad site dress and cleaning, and new component preparation.
Demonstrates guidelines for package-on-package device rework, including developing a thermal reflow profile, PCB pad site dress and cleaning, and new component preparation.Full View >