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Typhoon H* Drone Navigates in 3D with Intel® RealSense™ Technology

Change your view with the Yuneec Typhoon H* drone with Intel® RealSense™ technology to navigate and intelligently route around obstacles in 3D.

Intel Diversity and Inclusion Mid-Year Report 2016

Examines Intel's 2016 progress towards diversity and inclusion, including the goal for full representation in the U.S. workforce and beyond.

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Intel Diversity and Inclusion Annual Report 2016 Addendum

Report: Examines Intel's 2016 progress towards diversity and inclusion, including the goal for full representation in the U.S. workforce and beyond.

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SMT Board Assembly Process Guide

Guide: Overview of surface mount technology (SMT) board assembly process including reflow soldering SMT components and component replacement.

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Electrostatic Discharge and Electrical Overstress Guide

Guide: Overview of electrostatic discharge (ESD) and electrical overstress (EOS) with preventative measures and strategies for eliminating damage.

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Intel Strain Measurement Methodology for Circuit Board Assembly

Guide: Document provides overview of board flexure control methodology, Intel(r) BFI metrics, with motherboard assembly line strain measurement.

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Intel® Manufacturing Enabling Resource Guide

Guide: Gain access to Intel® Manufacturing Advantage Services (MAS) collaterals, register new accounts, find resources, and local Intel contacts.

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Intel, Your Trusted Reliability Advisor

See how Intel uses knowledge-based qualification to deliver fast, reliable, and efficient products while maintaining the highest quality.

Intel® Rack Scale Design PSME Release Notes

Release Notes: The latest engineering release updates the PSME API specifications, sources, and binaries for Intel® Rack Scale Design.

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Intel® Rack Scale Design Customer Release Notes

Release Note: Provides an update on Intel® Rack Scale Architecture package contents and new and changed features.

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