Mark Bohr explains how Intel 3-D transistors manufactured at 22 nm ensure the pace of technology advancement for years to come.
Intel's 3-D Tri-Gate transistor, and the ability to manufacture it in high volume, mark a dramatic change in the fundamental structure of the computer chip. Learn more about the history of transistors.Full View >
3D XPoint™ is a new breakthrough in non-volatile memory technology enabling memory-like performance at storage-like capacity and cost.
A new breakthrough in non-volatile memory technology, Intel® 3D XPoint™ offers memory-like performance at storage-like capacity and cost for more affordable multi-terabyte memory arrays and faster SSD storage.
Intel introduces innovative silicon technology processes, delivering leaps in performance and energy efficiency while enabling richer applications.
Following Moore's Law, Intel introduce new silicon technology processes, which deliver incredible leaps in performance and new levels of energy efficiency, performance, and richer end-user applications.
Backgrounder: Intel's 22 nm innovation ushers in new semiconductor technology and ensures the continuation of Moore's Law.
For the first time in history, silicon transistors are entering the third dimension. Intel is introducing the tri-gate transistor, in which the transistor channel is raised into the 3rd dimension.
Intel's silicon technology manufacturing makes fast, smart, and energy-efficient technologies to better performance and reduce environmental impact.
Intel silicon technology manufacturing emphasizes fast, smart, energy-efficient technologies to improve performance and reduce environmental impact.
This video shows how to set up an Intel® Intelligent Test System (Intel® ITS) configuration using an Intel® Server Board as a System Under Test (SUT).
This video demonstrates with detailed step-by-step instructions how to set up an Intel® Intelligent Test System (Intel® ITS) configuration using an Intel® Server Board as a System Under Test (SUT).Full View >