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Intel® 22nm Technology

Introducing 3-D transistors manufactured at 22nm for future microprocessor families, continuing pursuit of Moore's Law.

Mobile 4th Gen Intel® Core™ Processor Family: EDS, V.1

External Design Spec, V.1: Covers 4th gen Intel® Core™ processor technologies, power, thermal, signal, electrical, package specs. (v.2.5, Apr. 2014)

Haswell U/Y Processor-based Platform: Design Guide

Guide: Provides Haswell U/Y platform design recommendations, including for Windows* 8, instrumentation, PCB, signal, and more. (v.2.4, Feb. 2014)

Haswell U/Y Processor-based Platform: Design Guide

Guide: Provides Haswell U/Y platform design recommendations, including for Windows* 8, instrumentation, PCB, signal, and more. (v.2.4, Feb. 2014)

Mobile 4th Gen Intel® Core™ Processor Family: EDS, V.1

External Design Spec, V.1: Covers 4th gen Intel® Core™ processor technologies, power, thermal, signal, electrical, package specs. (v.2.5, Apr. 2014)

Haswell U/Y Processor-based Platform: Design Guide

Guide: Provides Haswell U/Y platform design recommendations, including for Windows* 8, instrumentation, PCB, signal, and more. (v.2.4, Feb. 2014)

Mobile 4th Gen Intel® Core™ Processor Family: EDS, V.1

External Design Spec, V.1: Covers 4th gen Intel® Core™ processor technologies, power, thermal, signal, electrical, package specs. (v.2.5, Apr. 2014)

Mobile 4th Gen Intel® Core™ Processor Family: EDS, V.1

External Design Spec, V.1: Covers 4th gen Intel® Core™ processor technologies, power, thermal, signal, electrical, package specs. (v.2.5, Apr. 2014)

Haswell U/Y Processor-based Platform: Design Guide

Guide: Provides Haswell U/Y platform design recommendations, including for Windows* 8, instrumentation, PCB, signal, and more. (v.2.4, Feb. 2014)

Haswell U/Y Processor-based Platform: Design Guide

Guide: Provides Haswell U/Y platform design recommendations, including for Windows* 8, instrumentation, PCB, signal, and more. (v.2.4, Feb. 2014)