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Analysis of Intel® Technology for Embedded Applications

White Paper: Supplemental info for using Intel® technology in embedded applications, including design requirement trade-offs. (v.2, May 2010)

Cave Creek PCH Icepak* Thermal Model and User’s Guide

User’s Guide: Icepak* thermal model for designers simulating, analyzing, and optimizing the Cave Creek Platform Controller Hub. (v.1.0, Jan. 2011)

Desktop Solder Joint Reliability Workshop: Presentation

Presentation: Desktop Solder Joint Reliability Workshop outlines design considerations, testing methods, and validation. (June 2008)

Tolapai Thermal Test Vehicle: User Guide

User Guide: Describes how to use the Tolapai Thermal Test Vehicle to validate heatsink designs, including a test board. (June 2007)

Intel® Xeon® Processor 5300 Series: Specification

Specification: Electrical, mechanical, and thermal specifications for the Intel® Xeon® processor 5300 series, including signal quality. (July 2007)

Intel® Core™2 Processor QX9000/Q9000/Q8000 Series: Specifications

Specification: Intel® Core™2 processor QX9000/Q9000/Q8000 series electrical, mechanical, thermal, and signal specs and features. (Jan. 2009)

Intel® Core™2 Extreme and Quad Processor: Thermal Guide

Thermal Design Guide: Describes Intel® Core™2 Extreme and Intel® Core™2 Quad processor thermal and cooling solution, and characteristics. (Nov. 2007)

IP Telephony Driver Architecture and Performance Measurement

White Paper: Describes IP telephony components with Intel® EP80579 Integrated Processor, including acceleration software architecture. (Jan. 2009)

Intel® Xeon® Processor 5400 Series: Specification

Specification: Provides Intel® Xeon® processor 5400 electrical, mechanical, thermal, signal, and debug tool specs and features. (Aug. 2008)

Intel® I/O Controller Hub 10: Thermal Design Guide

Thermal Design Guide: System recommendations for the Intel® I/O Controller Hub 10 for component temperature management. (v.2, June 2008)

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