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Salesforce Discusses Benefits of HP 3PAR StoreServ* Storage

Salesforce shares how they get their data moving with HP 3PAR StoreServ* storage—based on Intel® technology—to prevent performance bottlenecks.

Intel® I/O Controller Hub 9 Family: External Design Spec

Spec: Information for Intel® ICH9 family includes signal register and functional descriptions, and electrical and package features. (June 2008)

45nm Intel® Xeon® Processors 5400/5200 Series: Brief

Product Brief: Intel® Xeon® processors utilize 45nm Hi-k silicon technology to improve power consumption, switching speed, and transistor density.

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Intel® 82599 10 Gigabit Ethernet Controller: Specification Update

Covers hardware sightings, clarifications, changes, updates, errata, and software clarifications. (v.3.3, Feb. 2015)

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Intel® 5000P and 5000V Chipsets Product Brief

Intel® 5000P and 5000V chipsets support Fully Buffered DIMM technology at 533 and 667 MHz for fast application response.

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Intel® 5000X Chipset Product Brief

Product Brief: Intel® 5000X Chipset for the Intel® Xeon processor 5000 sequence offers balanced platforms for performance, productivity, efficiency.

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Intel® Xeon® Processor 5200 Series: Thermal Design Guide

Thermal Design Guide: Reference thermal solutions and design parameters for Intel® Xeon® processor 5200 series with dual-core technology. (Nov. 2007)

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Embedded Intel® Xeon® 3000/5000 Series with Intel® 5100 Chipset

The embedded Intel® Xeon® processor 5000/3000 series with Intel® 5100 chipset provides high performance, energy efficiency, and life cycle support.

Intel® Xeon® Processor 5400 Series: Design Guide

Thermal Design Guide: Describes Intel® Xeon® processor 5400 thermal solution, cooling solution, and characteristics. (v.001, Nov. 2007)

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Intel® Xeon® Processor 5100 Series: Thermal Guide

Guide: Thermal solutions and design parameters for the dual-core Intel® Xeon® processor 5100 series that demonstrate processor cooling features.

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