Specification Update, 2008: Intel® 3000 and 3010 chipset memory controller hub (MCH), clarifications, changes, and documentation errata.
Specification updates for the Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH), including device and documentation errata, specification clarification, and changes.
Describes the signal description, system address map, MCH register description, DRAM controller registers, primary and secondary bridge registers, electrical characteristics and ballout, and package information for the Intel® 3200 and 3210 chipsets.
Combines the performance of previous generation products with the power efficiencies of a low-power microarchitecture to enable smaller, quieter systems. These processors are 64-bit processors that maintain compatibility with IA-32 software.
Dual-core Intel® Xeon® processor 3000 series-based server platforms are ideal for building cost-sensitive yet powerful HPC clusters.
Economical high-performance computing platforms with outstanding reliability and value.
Datasheet: provides thermal specifications and guidelines for systems using Intel® Xeon® processor 3000 series.
Provides thermal specs, guidelines for systems using Intel® Xeon® processor 3000 series.
Datasheet: Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH).
The Intel® 3010 chipset is designed for use with Intel® Pentium® 4 processor 600 Sequence, Intel® Pentium® D processor 800 Sequence and 900 Sequence, Intel® Celeron® D, and Dual-Core Intel® Xeon® Processor 3000 Series in the LGA775 package.
Thermal and mechanical operating limits, specifications, and reference thermal solution for Intel® 3000 and 3010 chipsets memory controller hub (MCH).
This document outlines the thermal and mechanical operating limits and specifications for the Intel® 3000 and 3010 chipsets memory controller hub (MCH) and describes a reference thermal solution that meets their specification.