Case Study: Geoscience company CGG improves the accuracy of its seismic modeling for upstream oil and gas reservoirs with enhanced HPC clusters.
Case Study: Geoscience company CGG improves the accuracy of its seismic modeling for upstream oil and gas reservoirs using high performance computing clusters powered by Intel® Xeon® processor E5 and 2nd generation Intel® Xeon Phi™ product families.
Case Study: Georgia Tech accelerates aerospace research on a new Intel® Xeon® processor E5 family-based HPC cluster for larger, more complex problems.
Case Study: Georgia Institute of Technology accelerates aerospace research for governmental and industry collaborators using a new HPC cluster based on the Intel® Xeon® processor E5 family, addressing larger, more complex problems than before.
Researchers discuss how Intel® Parallel Computing Centers will provide the capabilities to answer bigger questions and make new discoveries.
The Intel® Xeon® processor E7 family is designed for the high performance computing solutions that enterprise IT services demand.
Enterprise IT services demand high performance computing with more mission-critical computing solutions optimized for the Intel® Xeon® processors family.
Heterogeneous and cloud computing meet high-performance computing and data throughput throughout the life sciences and healthcare value chains.
The combination of heterogeneous computing and cloud computing is emerging as a powerful new paradigm to meet the requirements for high-performance computing (HPC) and data throughput throughout the life sciences (LS) and healthcare value chains.
Enabling highly parallel processing, the Intel® Xeon Phi™ coprocessor delivers performance gains in animation, energy, finance, and other industries.
Intel® Xeon Phi™ coprocessor, a PCI Express* form factor add-in card for Intel® Xeon® processors, enables performance gains for highly parallel computing workloads for animation, energy, finance, life sciences, manufacturing, and other industries.
Highlights the benefits of the Intel® Xeon Phi™ product family, including parallel performance ideal for a range of real-world applications.
Intel® Xeon Phi™ coprocessor dense form factor board spec models, with a thermal profile, connector pinout, and FloTHERM* and Icepak* documentation.
Intel® Xeon Phi™ coprocessor dense form factor board specification models, with a thermal profile, connector pinout, and FlotTHERM* and Icepak* documentation.