Case Study: China TravelSky boosts services for aviation tourism by using Intel® technology to improve data center utilization and energy efficiency.
Case Study: China TravelSky boosts IT services for the aviation tourism industry by migrating its system to an Intel® Xeon® processor E7 family-based platform, which improves data center utilization, energy efficiency, and system stability.
Intel IT and Sales and Marketing created a scalable social collaboration framework that integrates business systems and provides working flexibility.
Intel IT and Sales and Marketing created a scalable social collaboration framework that integrates business systems and provides flexibility for the way employees work. This is increasing revenue as it improves customer insights and productivity.
Intel® E8870 Chipset allows for multi-node configurations of up to eight Intel® Itanium® processors, featuring the E8870SP component.
The Intel® E8870 Chipset builds upon its single-node platform predecessor and allows for multi-node configurations of up to eight Intel® Itanium® processors.
Technical Resources list for Intel® Itanium® Processor includes applications notes, datasheets, packing information, product briefs, and more.
List of technical resources including links to datasheets, packaging information, and more.
Intel IT’s business case for migrating, the challenges faced transitioning to a new platform, and the great benefits derived from the transition.
Intel IT discusses the business case for migrating, the challenges faced transitioning to a new platform for silicon design, manufacturing, and global enterprise resource planning at Intel, and the great benefits derived from the transition.Full View >
Packaging Databook, Ch. 10: product and transport media, environmental programs, tape and reel, protective bands, and shipping formats.
Chapter 10 Transport Media and Packing: Various packing and shipping methods used at Intel. Packing media, desiccant pack materials, and shipping data are illustrated.
Packaging Databook Ch 7: leaded surface mount technology enables more reliable assemblies with higher I/O, board density, and less weight and cost.
Chapter 7 Leaded Surface Mount Technology (SMT): A review of the mass reflow soldering technologies of printed circuit board (PCB) component assembly termed SMT (surface mount technology).