Technical Resources list for Intel® Itanium® Processor includes applications notes, datasheets, packing information, product briefs, and more.
List of technical resources including links to datasheets, packaging information, and more.
Intel IT’s business case for migrating, the challenges faced transitioning to a new platform, and the great benefits derived from the transition.
Intel IT discusses the business case for migrating, the challenges faced transitioning to a new platform for silicon design, manufacturing, and global enterprise resource planning at Intel, and the great benefits derived from the transition.Full View >
Intel IT and Sales and Marketing created a scalable social collaboration framework that integrates business systems and provides working flexibility.
Intel IT and Sales and Marketing created a scalable social collaboration framework that integrates business systems and provides flexibility for the way employees work. This is increasing revenue as it improves customer insights and productivity.
Packaging Databook, Ch. 10: product and transport media, environmental programs, tape and reel, protective bands, and shipping formats.
Chapter 10 Transport Media and Packing: Various packing and shipping methods used at Intel. Packing media, desiccant pack materials, and shipping data are illustrated.
Packaging Databook Ch 7: leaded surface mount technology enables more reliable assemblies with higher I/O, board density, and less weight and cost.
Chapter 7 Leaded Surface Mount Technology (SMT): A review of the mass reflow soldering technologies of printed circuit board (PCB) component assembly termed SMT (surface mount technology).
Packaging Databook, Ch. 3: packaging technologies for assembling three types of component packages for alumina and leaded molded technology.
Chapter 3 Alumina and Leaded Molded Technology: Statistical tools used in the manufacturing process. Also included is a comprehensive analysis of Intel’s IC assembly manufacturing technology and process flow.