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Intel® 7510/7512 Scalable Memory Buffer: Spec Update

Spec Update: Device and documentation errata, specification clarifications, and changes for the Intel® 7510/7512 Scalable Memory Buffer.

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Intel® Itanium® Processor: Specification Update

Intel® Itanium® processor provides device and documentation errata, specification clarifications, and changes.

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Intel® E8870 Chipset

Intel® E8870 Chipset allows for multi-node configurations of up to eight Intel® Itanium® processors, featuring the E8870SP component.

Intel® Itanium® Processor Technical Resources

Technical Resources list for Intel® Itanium® Processor includes applications notes, datasheets, packing information, product briefs, and more.

Tape Carrier Package: Databook, Chapter 12

Packaging Databook, Ch 12: Profile of the Tape Carrier Package and its uses in areas that require lightweight small footprint integrated circuits.

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Shipping and Transport Media: Packaging Databook, Ch. 10

Packaging Databook, Ch. 10: product and transport media, environmental programs, tape and reel, protective bands, and shipping formats.

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Leaded Surface Mount Technology: Intel's Packaging Databook, Ch. 7

Packaging Databook Ch 7: leaded surface mount technology enables more reliable assemblies with higher I/O, board density, and less weight and cost.

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ESD/EOS: Intel's Packaging Databook Ch. 6

Packaging Databook, Ch. 6: Electrical static discharge and electrical over stress.

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Alumina and Leaded Molded Technology, Packaging: Databook Ch. 3

Packaging Databook, Ch. 3: packaging technologies for assembling three types of component packages for alumina and leaded molded technology.

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Intel® Itanium® Processor 9500 Series

Learn about the Intel® Itanium® processor 9500 series: a powerful platform for virtualization and consolidation of today’s most demanding workloads.