Describes the signal description, system address map, MCH register description, DRAM controller registers, primary and secondary bridge registers, electrical characteristics and ballout, and package information for the Intel® 3200 and 3210 chipsets.
Thermal and Mechanical Design Guide: Intel® 3200 and Intel® 3210 Chipset Memory Controller Hub (MCH).
Discusses packaging technology, thermal specifications, simulation, metrology and solution, and component suppliers for the Intel® 3200 and 3210 Chipset.
Specification Update: Intel® I/O Controller Hub 9 (ICH9) family device and documentation errata, specification clarifications, and changes.
This document is a compilation of device and document errata and specification clarifications and changes, and is intended for hardware system manufacturers and for software developers of applications, operating system, and tools.
The Intel® 3200 and Intel® 3210 Chipsets are designed for use with Intel® Xeon® processors 3000Δ sequence.
The Intel® 3200 and Intel® 3210 Chipsets are designed for use with Intel® Xeon® processors 3000 sequence in the LGA775 package in UP server platforms. The chipsets contain two components: Memory Controller Hub and Intel® I/O Controller Hub 9.
Specification Update, 2009: Intel® 5400 Express Chipset memory controller hub (MCH), clarifications, changes, and documentation errata.
Specification updates for the Intel® 3200 and Intel® 3210 Chipset Memory Controller Hub (MCH), including device and documentation errata, specification clarification, and changes.