Solution Brief covers Intel and Ericsson reference design features for standards-based technologies for machine-to-machine platforms.
Discusses how Intel® M2M Reference Design, based on the Intel® Atom™ processor and the Ericsson F5521GW* mobile broadband module, provides a platform that reduces development time and cost.
Intel® I/O Controller Hub 10 (ICH10) Family.
Datasheet for Intel® I/O Controller Hub 10 (ICH10) Family
Specification Update: Intel® Core™2 processor QX9000/Q9000/Q8000 series update includes errata, clarifications, and changes. (Jan 2013)
Specification Update: Intel® Core™2 Extreme processor QX9000 series and Intel® Core™2 Quad processor Q9000 and Q8000 series update includes device and document errata and spec clarifications and changes. (Jan 2013)
Thermal Guide: Describes how to use embedded Intel® G45, G41, Q45, Q35 and Q965 Express Chipsets in 1U and PICMG 1.3 form factors. (v.1.5, Feb. 2009)
Thermal Design Guide: Describes guidelines for using embedded Intel® G45, G41, Q45, Q35 and Q965 Express Chipsets in 1U and PICMG 1.3 form factors. (v.1.5, Feb. 2009)
Intel® Xeon® processors make distributed-intelligence possible. Since components are connected, redistributing stored energy is more efficient.