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Manufacturing with Intel® FCBGA10/FCBGA11 Package Technologies

Presentation: Attributes, drawings, and guidelines for manufacturing with Intel® FCBGA10 and FCBGA11 package technologies. (v.2.6, Apr. 2015)

Intel® Xeon® Processor E3-1125C v2 and E3-1105C v2: Datasheet, V.1

Datasheet: Contains Intel® Xeon® processor E3-1125C/1105C v2 and Intel® Core™ i3 processor 3115C specs, signal definitions, and more. (v.2, Nov. 2013)

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Intel® Platform for Communications Infrastructure Systems

Platform Brief: Intel® processors and Intel® Communications Chipset 89xx Series provide a platform for communications infrastructure. (v.1, Aug. 2013)

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Intel® Xeon® E3-1105C v2/E3-1125C v2/Core™ i3-3115C/Pentium® B925C

Power Guidelines: Embedded app power guidelines for Intel® Xeon® E3-1125C v2/ E3-1105C v2, Core™ i3-3115C, and Pentium® B925C. (v.1, Oct. 2013)

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Intel® Communications Chipset 89xx Series: Datasheet

Datasheet: Technical and programming information on the Intel® Communications Chipset 89xx Series for architects and engineers. (v.5, Apr 2014)

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Intel® QuickAssist Technology API: Programmer’s Guide

Programmer’s Guide: Demonstrates how to use Intel® QuickAssist Technology APIs for software engineers and developers. (v.1, Jun. 2014)

Intel® QuickAssist Technology Cryptographic API: Reference Guide

Reference Guide: Cryptographic APIs for Intel® QuickAssist Technology, including data structures, typedefs, and functions. (v.1, Jun. 2014)

Cave Creek: BSDL Files

Files: Contains Cave Creek BSDL files, reference design license agreement, read me, and JTAG boundary scan testability.

Cave Creek PCH Icepak* Thermal Model and User’s Guide

User’s Guide: Icepak* thermal model for designers simulating, analyzing, and optimizing the Cave Creek Platform Controller Hub. (v.1.0, Jan. 2011)

CPIC with Cave Creek Technology: Bill of Materials

Bill of Materials: List of materials used on a CPIC platform with Cave Creek technology, including revision table of BOM changes.