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Intel® Communications Chipset 89xx Series: Datasheet

Datasheet: Technical and programming information on the Intel® Communications Chipset 89xx Series for architects and engineers. (v.5, Apr 2014)

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Intel® Platform for Communications Infrastructure Systems

Platform Brief: Intel® processors and Intel® Communications Chipset 89xx Series provide a platform for communications infrastructure. (v.1, Aug. 2013)

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Intel® Xeon® Processor E3-1125C v2 and E3-1105C v2: Spec Update

Spec Update: Intel® Xeon® processor E3-1125C and 1105C v2 and Intel® Core™ i3 processor 3115C errata, clarifications, and changes. (v.1, Aug. 2013)

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Intel® Processor, Formerly Ivy Bridge + Gladden: EDS, Vol. 1

External Design Spec, Vol. 1: Provides Intel® processor, formerly Ivy Bridge + Gladden electrical, signaling, pinout, and more specs. (v.1, Mar. 2013)

Ivy Bridge Gladden Thermal Model

Model: Contains the .pdml and .tzr model files and thermal model user guide for the Ivy Bridge Gladden processor. (v.0.5, Oct. 2012)

CPIC with Cave Creek Technology: Bill of Materials

Bill of Materials: List of materials used on a CPIC platform with Cave Creek technology, including revision table of BOM changes.

Cave Creek: BSDL Files

Files: Contains Cave Creek BSDL files, reference design license agreement, read me, and JTAG boundary scan testability.

Cave Creek PCH Icepak* Thermal Model and User’s Guide

User’s Guide: Icepak* thermal model for designers simulating, analyzing, and optimizing the Cave Creek Platform Controller Hub. (v.1.0, Jan. 2011)

Intel® Xeon® Processor E3-1125C v2 and E3-1105C v2: Datasheet, V.1

Datasheet: Contains Intel® Xeon® processor E3-1125C/1105C v2 and Intel® Core™ i3 processor 3115C specs, signal definitions, and more. (v.2, Nov. 2013)

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