Platform Brief: Intel® processors with Intel® Communications Chipset 89xxCC Series scale to smaller footprints without sacrificing performance.
Platform Brief: Intel® processor-based platforms with Intel® Communications Chipset 89xxCC Series extend the scalability to smaller footprint systems without sacrificing workload acceleration and compression, multicore processing, and virtualization.
Case Study: See how Intel® Quark™ processors help Star Course develop a high performance and low cost solution for the Internet of Vehicles in China.
Case Study: See how Intel® Quark™ processors enable Shenzhen Star Course Information Technology Co. Ltd. to develop an Internet of Vehicles new vehicle information terminal solution with a high cost-performance ratio and shortened time to market.
Solution brief: HyperScan pattern matching software scales with Intel® architecture to optimize deep packet inspection performance and throughput.
Solution brief: HyperScan pattern matching software scales with Intel® architecture to optimize deep packet inspection performance and help deliver 36 Gbps throughput on the Intel® Atom™ processor C2000.
Design Guide: Thermal mechanical material to aid integration of the 5th Generation Intel® Core™ processor-based mobile platforms. (v.2, Aug. 2015)
Thermal Mechanical Design Guide: This document is intended to provide material and guidance to aid in the integration of the 5th generation Intel® Core™ processor based mobile products into embedded applications. (v.2, Aug. 2015)