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Mobile Intel® Core™2 Duo Processors: Thermal Models

Thermal Models: Download Icepak* and Flotherm* models to simulate and optimize solutions for mobile Intel® Core™2 Duo processors. (v.1, Dec. 2006)

IXP45X/IXP46X Product Line: Design Guide

Hardware Design Guide: Recommendations for developing with the IXP45X/IXP46X product lines, including information on interfaces. (v.4, Feb. 2007)

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Embedded Design Tool: Motherboard Mechanical Layout Tool

Motherboard Mechanical Layout Tool provides relative mechanical shock risk information regarding chipset or platform controller hub placement.

All Things are Connected Because of Me

All Things are Connected Because of Me - Vantron Technology * IOT Gateway based on Intel® Intelligent Systems Framework

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System Mechanical Design Guidance for Dynamic Events: App Note

Application Note: Provides mechanical design guidance to improve shock performance and prevent failure in dynamic events. (v.001.6, July 2012)

Crystal Forest Gladden: Platform Design Guide

Platform Design Guide: Design guidelines for Crystal Forest Gladden components, including layout, routing, and power information. (v.1.8, May 2012)

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IXP42X Product Line: Application Brief

Application Brief: The IXP42X product line with Ethernet POWERLINK* software enables clear communication within the factory. (v.1, June 2005)

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IXP42X Product Line Thermal Design: Application Note

Application Note: Enables proper design of thermal solutions for the IXP42X product line, ensuring adequate cooling. (v.1, Nov. 2005)

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Customize RedBoot* for the IXP42X Product Line: App Note

Application Note: Provides guidance for customizing RedBoot* to load and execute images with the IXP42X product line. (v.2, Sept. 2004)

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PCI 16-Bit Read Implementations for IXP42X Product Line: App Note

Application Note: Describes PCI 16-bit memory read implementations for the IXP42X product line, including pin logic and drawings. (v.2, Sept. 2004)

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