Thermal Models: Download Icepak* and Flotherm* models to simulate and optimize solutions for mobile Intel® Core™2 Duo processors. (v.1, Dec. 2006)
Hardware Design Guide: Recommendations for developing with the IXP45X/IXP46X product lines, including information on interfaces. (v.4, Feb. 2007)
Motherboard Mechanical Layout Tool provides relative mechanical shock risk information regarding chipset or platform controller hub placement.
All Things are Connected Because of Me - Vantron Technology * IOT Gateway based on Intel® Intelligent Systems Framework
Application Brief: The IXP42X product line with Ethernet POWERLINK* software enables clear communication within the factory. (v.1, June 2005)
Application Note: Enables proper design of thermal solutions for the IXP42X product line, ensuring adequate cooling. (v.1, Nov. 2005)
Application Note: Provides guidance for customizing RedBoot* to load and execute images with the IXP42X product line. (v.2, Sept. 2004)
Application Note: Describes PCI 16-bit memory read implementations for the IXP42X product line, including pin logic and drawings. (v.2, Sept. 2004)