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El procesamiento de paquetes se mejora mediante el software Intel® DPDK

Las mejoras en la arquitectura multi-core hacen que el procesamiento de paquetes sea viable en los procesadores Intel®, lo que trae como resultado un mayor desempeño y menores costos de hardware.

インテル® データ・プレーン開発キット・ソフトウェアによってパケット処理を強化

マルチコア・アーキテクチャーの改良によりパケット処理がインテル® プロセッサーで実行可能になり、高い性能の確保とハードウェア・コストの削減が可能になりました。

Shock Strain Monitoring Approach: Customer Reference Document

Document: Outlines shock strain monitoring approach to evaluate second-level interconnect risks for relative design performance. (v.1.1, Mar. 2014)

Intel® Atom™ Processor E6xx Series: External Design Spec

Describes Intel® Atom™ processor E6xx series functionality, including signals, registers, and electrical descriptions. (v.4, Mar. 2013)

Maho Bay and Carlow-WS: Platform Design Guide

Platform Design Guide: Recommendations for the Maho Bay and Carlow-WS platform, including platform controller hub, system memory. (v.2.2, May 2013)

Manufacturing with Intel® FCBGA10/FCBGA11 Package Technologies

Presentation: Attributes, drawings, and guidelines for manufacturing with Intel® FCBGA10 and FCBGA11 package technologies. (v.2.5, Jul. 2014)

Intel® Communications Chipset 89xx Series Linux* Software Download

Download Instructions: Provides a link to the Intel® Communications Chipset 89xx series software package for Linux*. (v.1, Jul. 2013)

Shell Bay Customer Reference Board: Schematic

Schematic: Provides detailed diagrams of the Shell Bay customer reference board featuring the Intel® Platform Controller Hub EG20T. (v.3.1, Aug. 2011)

Cougar Canyon Customer Reference Board: User Guide

User Guide: Hardware set-up procedures, features, and configuration settings for the Cougar Canyon customer reference board. (v.0.95, Aug. 2011)

Stargo Customer Reference Board: Schematic

Schematic: Drawings, revision list, and BOM for the Stargo customer reference board development kit. (v.2.1, Jul. 2013)