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Mobile Intel® Core™2 Duo Processors: Thermal Models

Thermal Models: Download Icepak* and Flotherm* models to simulate and optimize solutions for mobile Intel® Core™2 Duo processors. (v.1, Dec. 2006)

IXP45X/IXP46X Product Line: Design Guide

Hardware Design Guide: Recommendations for developing with the IXP45X/IXP46X product lines, including information on interfaces. (v.4, Feb. 2007)

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Embedded Design Tool: Motherboard Mechanical Layout Tool

Motherboard Mechanical Layout Tool provides relative mechanical shock risk information regarding chipset or platform controller hub placement.

System Mechanical Design Guidance for Dynamic Events: App Note

Application Note: Provides mechanical design guidance to improve shock performance and prevent failure in dynamic events. (v.001.6, July 2012)

Crystal Forest Gladden: Platform Design Guide

Platform Design Guide: Design guidelines for Crystal Forest Gladden components, including layout, routing, and power information. (v.1.8, May 2012)

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IXP42X Product Line: Application Brief

Application Brief: The IXP42X product line with Ethernet POWERLINK* software enables clear communication within the factory. (v.1, June 2005)

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IXP42X Product Line Thermal Design: Application Note

Application Note: Enables proper design of thermal solutions for the IXP42X product line, ensuring adequate cooling. (v.1, Nov. 2005)

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Customize RedBoot* for the IXP42X Product Line: App Note

Application Note: Provides guidance for customizing RedBoot* to load and execute images with the IXP42X product line. (v.2, Sept. 2004)

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PCI 16-Bit Read Implementations for IXP42X Product Line: App Note

Application Note: Describes PCI 16-bit memory read implementations for the IXP42X product line, including pin logic and drawings. (v.2, Sept. 2004)

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