Thermal Models: Download Icepak* and Flotherm* models to simulate and optimize solutions for mobile Intel® Core™2 Duo processors. (v.1, Dec. 2006)
Hardware Design Guide: Recommendations for developing with the IXP45X/IXP46X product lines, including information on interfaces. (v.4, Feb. 2007)
Motherboard Mechanical Layout Tool provides relative mechanical shock risk information regarding chipset or platform controller hub placement.
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Application Brief: The IXP42X product line with Ethernet POWERLINK* software enables clear communication within the factory. (v.1, June 2005)
Application Note: Enables proper design of thermal solutions for the IXP42X product line, ensuring adequate cooling. (v.1, Nov. 2005)
Application Note: Provides guidance for customizing RedBoot* to load and execute images with the IXP42X product line. (v.2, Sept. 2004)
Application Note: Describes PCI 16-bit memory read implementations for the IXP42X product line, including pin logic and drawings. (v.2, Sept. 2004)