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Intel® Xeon® Processor 5300 Series: Specification

Specification: Electrical, mechanical, and thermal specifications for the Intel® Xeon® processor 5300 series, including signal quality. (July 2007)

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Reducing S3 State Power on Calpella Platform

White Paper: Describes a system-level implementation to reduce processor power use on the Calpella platform during ACPI S3 state. (v.1, Aug. 2009)

Calpella on Desktop: Thermal Guide Addendum

Thermal Design Guide Addendum: Provides Calpella on Desktop platform-specific mechanical, thermal, and electrical considerations. (Oct. 2008)

Intel® Atom™ Processor N2000/D2000 Series: Thermal Design Guide

Covers Intel® Atom™ processor N2000/D2000 Series-based platform (Cedarview) thermal design power, and thermal performance. (v.1, Jul. 2011)

Intel® 5520/5500 Chipset: Thermal Guide

Thermal and Mechanical Design Guide: Intel® 5520 and Intel® 5500 Chipset IOH.

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Verifying Intel® Turbo Boost Technology on a System

Demonstrates how to verify whether a system is engaged in Intel® Turbo Boost Technology by using utilities and registers. (v.1, Oct. 2010)

Intel® Core™ Processors (M/H-Processor Lines) Datasheet, Vol. 1

Datasheet, Vol. 1: Covers power and thermal management and package support for mobile 4th gen Intel® Core™ processors (M and H-processor lines).

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Intel® Core™ Processors (U/Y-Processor Lines) Datasheet, Vol. 1

Datasheet, Vol. 1: Covers power and thermal management and package support for mobile 4th gen Intel® Core™ processors (U and Y-processor lines).

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Intel® Xeon® Processor E5-2400 Product Family: Thermal Guide

Thermal/mechanical, and heatsink design solutions for server and workstation processors in the Intel® Xeon® processor E5-2400 product family platform.

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Introduction to Embedded Platforms and Design Support

Describes differences between embedded and non-embedded platforms and the reference material available to support embedded designs.