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Automation Technology for the Connected Factory

Industrial automation technology built on Intel® architecture brings energy efficiency, safety, productivity, connectivity to the factory.

Intel® ICH Family SPI Flash Programming Guide: Application Note

Application Note: Clarify aspects of programming SPI flash on ICH family-based platforms, includes compatibility, BIOS, and tools.(v.2.4, Sept. 2008)

Cave Creek PCH Icepak* Thermal Model and User’s Guide

User’s Guide: Icepak* thermal model for designers simulating, analyzing, and optimizing the Cave Creek Platform Controller Hub. (v.1.0, Jan. 2011)

Desktop Solder Joint Reliability Workshop: Presentation

Presentation: Desktop Solder Joint Reliability Workshop outlines design considerations, testing methods, and validation. (June 2008)

Tolapai Thermal Test Vehicle: User Guide

User Guide: Describes how to use the Tolapai Thermal Test Vehicle to validate heatsink designs, including a test board. (June 2007)

Intel® 5100 Memory Controller Hub Chipset: Design Spec Addendum

Addendum: Supplements external design specification for the Intel® 5100 Memory Controller Hub Chipset with AC information. (July 2008)

Intel® 5100 Memory Controller Hub Chipset: Design Specification

Design Spec: Revises product information and design guidelines for the Intel® 5100 Memory Controller Hub Chipset. (July 2009)

Intel® Xeon® Processor 5300 Series: Specification

Specification: Electrical, mechanical, and thermal specifications for the Intel® Xeon® processor 5300 series, including signal quality. (July 2007)

Intel® Core™2 Processor QX9000/Q9000/Q8000 Series: Specifications

Specification: Intel® Core™2 processor QX9000/Q9000/Q8000 series electrical, mechanical, thermal, and signal specs and features. (Jan. 2009)

Intel® Core™2 Extreme and Quad Processor: Thermal Guide

Thermal Design Guide: Describes Intel® Core™2 Extreme and Intel® Core™2 Quad processor thermal and cooling solution, and characteristics. (Nov. 2007)

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