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Low Power System Design with Memory Down

White Paper: Design a low power, scalable embedded system with memory down on the PCB instead of traditional memory connectors. (v.001, Aug. 2009)

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CPU Temperature Monitor: Intel DTS and PECI

White Paper: Monitor CPU temperature data reported by on-die DTS and PECI to develop power management and thermal control schemes. (v.1, Sept. 2010)

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Embedded Intel® Xeon® 3000/5000 Series with Intel® 5100 Chipset

The embedded Intel® Xeon® processor 5000/3000 series with Intel® 5100 chipset provides high performance, energy efficiency, and life cycle support.

Intel® 82599 10 Gigabit Ethernet Controller: Specification Update

Covers hardware sightings, clarifications, changes, updates, errata, and software clarifications. (v.3.3, Feb. 2015)

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Intel® 5000P Chipset MCH BSDL

BSDL file: The Intel® 5000P chipset MCH BSDL with the latest stepping (B3 and G1) for the Intel® Xeon® Processor 5000 series. (v.1, Oct. 2006)

Intel® Xeon® Processor E5-2400 Product Family: Thermal Guide

Thermal/mechanical, and heatsink design solutions for server and workstation processors in the Intel® Xeon® processor E5-2400 product family platform.

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Intel® Xeon® Processor i3-2115 C: Power Guideline Addendum

Power Guideline Addendum: Provides power numbers on the Intel® Xeon® processor i3-2115 C while running real life applications. (v.001, Aug. 2012)

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Intel® Communications Chipset 8920: Power Guide Addendum

Addendum: Provides power consumption information on the Intel® Communications Chipset 8920 while it is running on industry standard applications.

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45nm Intel® Xeon® Processors 5400/5200 Series: Brief

Product Brief: Intel® Xeon® processors utilize 45nm Hi-k silicon technology to improve power consumption, switching speed, and transistor density.

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Intel® Architecture: Enable the Smart Grid

Intel® Xeon® processors make distributed-intelligence possible. Since components are connected, redistributing stored energy is more efficient.