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Intel® Atom™ Processors N450/D410/D510: Thermal Design Guide

Thermal Design Guide: Describes thermal characteristics, solutions for Intel® Atom™ processors N450/D410/D510 on the micro Flip Chip Ball Grid Array.

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3rd Generation Intel® Core™ i7 Processor Family: Addendum

App Power Guide Addendum: Provides power numbers while running real-life apps on the Intel® Core™ i7 processor family. (v.3, Aug. 2012)

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Intel® Core™ i7-3770 Processor: Application Power Guide Addendum

App Power Guideline Addendum: Provides power numbers for the Intel® Core™ i7-3770 processor while running real-life applications. (v.1, May 2012)

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Verifying Intel® Turbo Boost Technology on a System

Demonstrates how to verify whether a system is engaged in Intel® Turbo Boost Technology by using utilities and registers. (v.1, Oct. 2010)

Intel® 6 Series Express/Intel® C200 Series Chipsets: Spec

Spec: Interface, controller, functional, signal, and power descriptions for Intel® 6 Series Express and Intel® C200 Series Chipsets (v.2.2, Sep. 2012)

Intel® 5520/5500 Chipset: Thermal Guide

Thermal and Mechanical Design Guide: Intel® 5520 and Intel® 5500 Chipset IOH.

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Intel® Core™ i5-3610ME Processor: Application Power Guide Addendum

App Power Guideline Addendum: Provides power numbers for the Intel® Core™ i5-3610ME processor while running real-life applications. (v.1, July 2012)

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Intel® Xeon® Processor 5400 Series: Design Guide

Thermal Design Guide: Describes Intel® Xeon® processor 5400 thermal solution, cooling solution, and characteristics. (v.001, Nov. 2007)

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Intel® Atom™ LEAP* Platform: Energy-Efficient Embedded Computing

Reiher and Kaiser, UCLA, discuss Intel® Atom™ LEAP* architecture and embedded systems instructions for energy efficiency.

Embedded Intel® Architecture: Board Bring Up Procedure

White Paper: Explains motherboard stability tests and debug methods to solve issues during embedded Intel® architecture-based board bring up.

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