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Intel® Xeon® Processor E5-2400 Product Family: Thermal Guide

Thermal/mechanical, and heatsink design solutions for server and workstation processors in the Intel® Xeon® processor E5-2400 product family platform.

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Low Power System Design with Memory Down

White Paper: Design a low power, scalable embedded system with memory down on the PCB instead of traditional memory connectors. (v.001, Aug. 2009)

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CPU Temperature Monitor: Intel DTS and PECI

White Paper: Monitor CPU temperature data reported by on-die DTS and PECI to develop power management and thermal control schemes. (v.1, Sept. 2010)

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Intel® NM10 Express Chipset: Spec Update

Intel® NM10 Express Chipset update identifies device and documentation errata, specification clarifications, and specification changes.

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Intel® Xeon® Processor i3-2115 C: Power Guideline Addendum

Power Guideline Addendum: Provides power numbers on the Intel® Xeon® processor i3-2115 C while running real life applications. (v.001, Aug. 2012)

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Intel® Communications Chipset 8920: Power Guide Addendum

Addendum: Provides power consumption information on the Intel® Communications Chipset 8920 while it is running on industry standard applications.

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Intel® Core™2 Processor QX9000/Q9000/Q8000 Series: Specifications

Specification: Intel® Core™2 processor QX9000/Q9000/Q8000 series electrical, mechanical, thermal, and signal specs and features. (Jan. 2009)

Intel® Core™2 Extreme and Quad Processor: Thermal Guide

Thermal Design Guide: Describes Intel® Core™2 Extreme and Intel® Core™2 Quad processor thermal and cooling solution, and characteristics. (Nov. 2007)

Intel® Atom™ Processor D2000 Series: Thermal Design Guide

Describes Intel® Atom™ processor D2000 Series specs, reference design thermal solution, and associated retention components.

Cedar Rock Mini-ITX Customer Reference Board: Bill of Materials

Cedar Rock Mini-ITX materials list includes a product description of assemblies, subassemblies, and basic parts.