The browser version you are using is not recommended for this site.Please consider upgrading to the latest version of your browser by clicking one of the following links.
We are sorry, This PDF is available in download format only
Intel® EP80579 Integrated Processor Product Line: Thermal GuideThe power dissipation required for electronic components has risen along with the increase in complexity of computer systems. To ensure quality, reliability, and performance goals are met over a product's life cycle, the heat generated by the component must be properly dissipated. Typical methods to improve heat dissipation include selective use of airflow ducting, and/or the use of heatsinks.The goals of this document are to:• Describe the thermal and mechanical specifications for Intel® EP80579 Integrated Processor product line• Describe reference solutions that meet the Intel® EP80579 Integrated Processor product line’s thermal and mechanical specificationsRead the full Intel® EP80579 Integrated Processor Product Line Thermal Design Guide.
Discusses Intel® Atom™ LEAP* architecture and embedded systems instructions for energy efficiency.
Intel® Xeon® processors provide power savings, scalability performance, integration, and more.
Presents research on multi-core processor performance optimization under thermal constraints.
Demos digital signage innovations: interactive screens, remote management, and video analytics.
Describes how Intel® technology reduces accidents and improves safety in Rio de Janeiro, Brazil.
Demos applications including license plate, missing people, and threat recognition. (v.001, Oct. 2010)