Dual-Core Intel® Xeon® Processor LV and ULV Thermal Design Guide
The power dissipation of electronic components has risen along with the increase in complexity of computer systems. To ensure quality, reliability, and performance goals are met over the product’s life cycle, the heat generated by the device must be properly dissipated. Typical methods to improve heat dissipation include selective use of airflow ducting and/or the use of heatsinks.
The goals of this document are to:
• Explain the thermal and mechanical specification for the Dual-Core Intel® Xeon® processor LV and ULV
• Describe a reference thermal solution that meets the specifications
A properly designed thermal solution adequately cools the device die temperature at or below the thermal specification. This is accomplished by providing a suitable local ambient temperature, ensuring adequate local airflow, and minimizing the die to local ambient thermal resistance. Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component.
Read the full Dual-Core Intel® Xeon® Processor LV and ULV Thermal Design Guide.