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Embedded Application Celeron® D Processor Thermal Design Guide

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Embedded Application Celeron® D Processor Thermal Design Guide

Introduction
This document describes thermal design guidelines for the Intel® Celeron ® D processor for embedded applications in the Flip-Chip Pin Grid Array (FC-mPGA4) package that interfaces with the motherboard through an mPGA478B socket. Detailed mechanical and thermal specifications for these processors may be found in the processor datasheet.

The information provided in this document is for reference only and additional validation must be performed prior to implementing the designs into final production. The intent of this document is to assist OEMs with the development of thermal solutions for their individual designs. The final heatsink solution, including the heatsink, attachment method, and Thermal Interface Material (TIM) must comply with the mechanical design, environmental, and reliability requirements delineated in the Intel Celeron D Processor Datasheet. It is the responsibility of each OEM to validate the thermal solution design with their specific applications.

Read the full Embedded Application Celeron® D Processor Thermal Design Guide.

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